max30102(max30102中文数据手册)

max30102(max30102中文数据手册)MAX30102 High Sensitivity Pulse Oximeter and Heart Rate Sensor for Wearable Health MAX30102 High Sensitivity Pulse Oximeter and Heart Rate Sensor for Wearable Health Electrical Characterist continued VDD 1 8V VIR LED VR LED 5 0V TA

MAX30102 High-Sensitivity Pulse Oximeter and

Heart-Rate Sensor for Wearable Health

MAX30102 High-Sensitivity Pulse Oximeter and

Heart-Rate Sensor for Wearable Health

Electrical Characteristics (continued)

(VDD = 1.8V, VIR_LED+ = VR_LED+ = 5.0V, TA = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C) (Note 2)

Maxim Integrated │ PAGE 4

Maxim Integrated │ PAGE 3

MAX30102

一般的描述

MAX30102是一个集成的脉搏血氧仪和心率监测模块。它包括内部发光二极管,光电探测器,光学件,以及低噪音的电子设备。MAX30102提供了一个完整的系统解决方案来简化移动和可穿戴设备的设计过程。

MAX30102运行在一个1.8V电源和一个单独的5.0V电源的内部发光二极管。通信是通过一个标准的i2c兼容接口。该模块可以通过零备用电流的软件关闭,使电力轨道始终保持供电。

应用程序

●可穿戴设备

●健康助理设备

系统图

高灵敏度脉搏血氧仪和可穿戴健康的心率传感器

的特点和好处

●心率监测和脉氧仪传感器

领导反思解决方案

●小x 3.3毫米3.3毫米5.6毫米14-Pin光学模块

?集成罩杯最佳,性能强劲。

●超低功率操作移动设备

?可编程采样率和LED电流,以节省电能。

?低功率心率监测器( 1mW)

?超低关闭当前(0.7μa typ)

●快速数据输出功能

?高采样率

●健壮的运动工件的弹性

?高信噪比

19 - 7740;牧师0;9/15

●40°C + 85°C的工作温度范围

PHOTO

PHOTO

DIODE

LED DRIVERS

RED/IR LED

PACKAGING

HUMAN

SUBJECT

ELECTRICAL

OPTICAL

AMBIENT

LIGHT

BIT

18-

CURRENT ADC

AMBIENT LIGHT

CANCELLATION

DIGITAL NOISE

CANCELLATION

DATA

FIFO

HOST (AP)

I

2

C

DRIVER

HARDWARE FRAMEWORK

APPLICATIONS

ACRYLIC

(

COVER

GLASS)

MAX30102

19-7740; Rev 0; 9/15

Ordering Information appears at end of data sheet.

Absolute Maximum Ratings

VDD to GND -0.3V to +2.2V GND to PGND -0.3V to +0.3V

X_DRV, VLED+ to PGND -0.3V to +6.0V

All Other Pins to GND -0.3V to +6.0V

Output Short-Circuit Current Duration Continuous

Continuous Input Current into Any Terminal ±20mA

ESD, Human Body Model (HBM) 2.5kV Latchup Immunity ±250mA

Package Thermal Characteristics (Note 1)

OESIP

Junction-to-Ambient Thermal Resistance (θJA) 180°C/W Continuous Power Dissipation (TA = +70°C)

OESIP (derate 5.5mW/°C above +70°C) 440mW Operating Temperature Range -40°C to +85°C Junction Temperature +90°C

Soldering Temperature (reflow) +260°C Storage Temperature Range -40°C to +105°C

Junction-to-Case Thermal Resistance (θJC) 150°C/W

Note 1: Package thermal resistances were obtained using the method described in JEDEC

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